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Technical Program Manager

Posted 1 week ago by Aditi Consulting

Summary

This role supports a business group focused on developing next-generation AR wearable devices. The team is driving innovation in flexible and rigid circuit board design, enabling advanced features in compact form factors. The need arises from increased project volume and the complexity of integrating new electrical components into wearable products.

Responsibilities

  • Responsible for electrical parts and components in big tech, with a focus on AR wearables and small electrical components.
  • Work outside standard hours to accommodate collaboration with APAC vendors.
  • End-to-end ownership of PCB fabrication, including schematics, layouts, and form development through to execution and vendor approval for part fabrication.
  • Experience in wearables, especially AR wearables and small electrical components.
  • Direct ownership of design releases for flexes and MLBs (multi-layer boards) from early design through production.
  • Collaborate with electrical engineers and cross-functional teams to develop flexible circuits and rigid circuit boards.
  • Gather feedback, track schedules, and highlight risks throughout the development process.
  • Manage SMT (Surface Mount Technology) and FATP (Final Assembly, Test, and Pack) builds end-to-end, optimizing for schedule, quality, and yield.
  • Engage directly with APAC contract manufacturers, ensuring supplier readiness and managing flex vendor relationships.

Qualifications

  • Minimum 5 years in electrical design, PCB development, or related hardware engineering roles.
  • Experience in wearables or consumer electronics preferred.
  • Degree in Electrical Engineering or related field preferred, but not required. Relevant experience is more important than formal education.

Skills

  • Direct ownership of design releases for flexes and MLBs (multi-layer boards) from early design through production.
  • Managing SMT and FATP builds end-to-end, including schedule, quality, and yield optimization.
  • Hands-on APAC CM (Contract Manufacturer) management, including flex vendor engagement and supplier readiness.
  • Experience with AR wearable device development.
  • Familiarity with small electrical component integration in compact form factors.
  • Knowledge of advanced PCB fabrication techniques and materials.

Pay Transparency

The typical base pay for this role across the U.

S. is: $80.00 - $84.00 /hour. Non-exempt positions are eligible for overtime at a rate of 1.5 times the base hourly rate for all hours worked in excess of 40 in a work week, or as required by state or local law. Final offer amounts, within the base pay set forth above, are determined by factors including your relevant skills, education and experience. Full-time employees are eligible to select from different benefits packages. Packages may include medical, dental, and vision benefits, health savings accounts with qualified medical plan enrollment, 10 paid days off, 3 days paid bereavement leave, 401(k) plan participation with employer match, life and disability insurance, commuter benefits, dependent care flexible spending account, accident insurance, critical illness insurance, hospital indemnity insurance, accommodations and reimbursement for work travel, and discretionary performance or recognition bonus. Sick leave and mobile phone reimbursement provided based on state or local law.

Rate:
Not specified
Location:
Remote
IR35 Status:
Outside
Remote Status:
Remote
Industry:
IT
Seniority Level:
Senior

Take-Home Pay

Not Available

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