Key Responsibilities
- Direct ownership of design releases for flexes and MLBs (multi-layer boards) from early design through production.
- Collaborate with electrical engineers and cross-functional teams to develop flexible circuits and rigid circuit boards.
- Gather feedback, track schedules, and highlight risks throughout the development process.
- Manage SMT (Surface Mount Technology) and FATP (Final Assembly, Test, and Pack) builds end-to-end, optimizing for schedule, quality, and yield.
- Engage directly with APAC contract manufacturers, ensuring supplier readiness and managing flex vendor relationships.
Key Requirements and Technology Experience
- Key skills: -TPM, PCB, DFM
- Direct ownership of design releases for flexes and MLBs (multi-layer boards) from early design through production.
- Managing SMT and FATP builds end-to-end, including schedule, quality, and yield optimization.
- Hands-on APAC CM (Contract Manufacturer) management, including flex vendor engagement and supplier readiness.
Industry:
Project Management
Seniority Level:
Not Specified