Printed Circuit Board Designer
Posted 2 weeks ago by Outsource UK
£69 Per hour
Inside
Hybrid
Cowes, England, United Kingdom
Summary: The role of PCB Designer involves creating complex multi-layer PCB designs, from initial concepts to manufacturing data packs, while adhering to ITAR and UK Eyes only restrictions. The position requires a detailed understanding of PCB design techniques and tools, with a focus on high-speed digital and RF technologies. The designer will also maintain toolsets and libraries, ensuring compliance with clearance levels. This is a hybrid role based in Cowes, requiring on-site presence three days a week.
Key Responsibilities:
- Generate large, complex, multi-substrate PCB designs.
- Undertake PCB design activities from initial concepts to manufacturing data packs.
- Help maintain toolsets and supporting libraries/databases.
Key Skills:
- Detailed knowledge of PCB design techniques for large, complex, multi-layer, multi-substrate PCBs.
- Experience in designing for controlled impedance, high-speed digital, RF, mixed signal, high current, and large FPGA technologies.
- Experience with blind, buried, and filled via techniques.
- Experience with flexible PCB and interconnecting assemblies.
- Familiarity with industry-standard toolsets, with Cadence experience being advantageous.
Salary (Rate): £69.65 hourly
City: Cowes
Country: United Kingdom
Working Arrangements: hybrid
IR35 Status: inside IR35
Seniority Level: undetermined
Industry: IT
PCB Designer
Location: Cowes
Duration : 6 months
Working arrangements: Hybrid on site 3 days per week
Restrictions : ITAR and UK Eyes only
Clearance Level: BPSS and SC in flight
Hourly Rate: £51.60 PAYE or £69.65 Umbrella
Have detailed knowledge and experience of tools and techniques required to generate large, complex, multi-substrate PCB designs. Undertake PCB design activities from initial concepts through to generation of manufacturing data packs. Help maintain toolsets and supporting libraries/databases.
Knowledge: PCB design techniques for large, complex, multi-layer, multi-substrate, PCBs. (ca. 16 layer) Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies. Experience of blind, buried, and filled via techniques. Experience of flexible PCB and interconnecting assemblies. Experience of one or more industry standard toolsets, cadence experience would be advantageous.