IC Package Designer
Posted 1 day ago by IC Resources
Negotiable
Outside
Undetermined
West Berkshire, England, United Kingdom
Summary: IC Resources is seeking an experienced IC Package Design Engineer for a contract role focused on end-to-end package design and verification in a semiconductor project. The position involves collaboration with assembly partners and internal engineering teams to deliver high-quality BGA and LF package solutions. This is a 3-month initial contract, classified as outside IR35, with multiple potential working locations.
Key Responsibilities:
- Deliver all package design activities within project timelines
- Lead package design reviews with assembly subcontractors; ensure full design-rule compliance
- Work closely with IC layout engineers throughout the design phase
- Verify electrical characteristics using relevant software tools
- Incorporate cost-effective methodologies into BGA substrate and LF designs
- Provide guidance and support on all assembly/package-related issues
- Produce detailed weekly progress reports
- Collaborate with product design, engineering, marketing, and assembly partners to meet package technology requirements
Key Skills:
- 5+ years in IC package design using Cadence APD/SIP
- Hands-on use of Cadence (Virtuoso / ExtractIM / PowerDC) and Ansys tools (SiWave / Q3D) or equivalents
- Experience with AutoCAD
- Strong knowledge of electronic IC packaging technologies
- Basic understanding of thermal, mechanical, and IC physical layout considerations
Salary (Rate): undetermined
City: West Berkshire
Country: United Kingdom
Working Arrangements: undetermined
IR35 Status: outside IR35
Seniority Level: undetermined
Industry: Other
IC Resources is looking for an experienced IC Package Design Engineer to support a fast-paced semiconductor project. This contract role focuses on end-to-end package design, verification, and collaboration with assembly partners, working closely with internal engineering teams to deliver high-quality, cost-effective BGA and LF package solutions. This role will be a 3 month initial contract, Outside IR35 with a few potential working locations.
Key Responsibilities
- Deliver all package design activities within project timelines
- Lead package design reviews with assembly subcontractors; ensure full design-rule compliance
- Work closely with IC layout engineers throughout the design phase
- Verify electrical characteristics using relevant software tools
- Incorporate cost-effective methodologies into BGA substrate and LF designs
- Provide guidance and support on all assembly/package-related issues
- Produce detailed weekly progress reports
- Collaborate with product design, engineering, marketing, and assembly partners to meet package technology requirements
Required Experience
- 5+ years in IC package design using Cadence APD/SIP
- Hands-on use of Cadence (Virtuoso / ExtractIM / PowerDC) and Ansys tools (SiWave / Q3D) or equivalents
- Experience with AutoCAD
- Strong knowledge of electronic IC packaging technologies
- Basic understanding of thermal, mechanical, and IC physical layout considerations
If you are interested in this opportunity then please contact Max Martin at IC Resources